Glossary of Terms

Definitions of every acronym and concept used in TekPulse.

A — F

ATE
Automated Test Equipment. Final-test stage in semiconductor manufacturing.
BIS Entity List
US Bureau of Industry and Security list of entities subject to export restrictions.
BOM
Bill of Materials. The list of components that make up a product.
Composite score
TekPulse's combined risk score 0-100 across all five dimensions.
DPA
Data Processing Agreement. Required under GDPR for processors handling personal data on behalf of controllers.
EOL
End of Life. Manufacturer has announced production will cease.

G — N

GDPR
General Data Protection Regulation. EU privacy law applicable since 2018.
HKDF
HMAC-based Key Derivation Function. Used to derive per-company keys from a master key.
HTS
Harmonized Tariff Schedule. US classification system for tariff calculation.
JWT
JSON Web Token. Stateless authentication token format used for API access.
MLCC
Multi-Layer Ceramic Capacitor. The most common capacitor type in modern PCBs.
MPN
Manufacturer Part Number. The unique identifier assigned by a component manufacturer.
NRND
Not Recommended for New Designs. Manufacturer lifecycle status indicating EOL is coming.

O — Z

OFAC
US Office of Foreign Assets Control. Maintains sanctions lists.
OSAT
Outsourced Semiconductor Assembly and Test. The assembly stage of chip manufacturing.
PCN
Product Change Notice. Manufacturer notification of a change to a component.
REACH
EU Registration, Evaluation, Authorisation and Restriction of Chemicals regulation.
RoHS
EU Restriction of Hazardous Substances directive. Limits lead, mercury, cadmium, and other substances.
SCIP
Substances of Concern In Products. EU database under the Waste Framework Directive.
Section 301
US trade-act provision used to impose tariffs on China-origin electronics.
SVHC
Substances of Very High Concern. REACH classification triggering reporting obligations.
TARIC
EU Integrated Tariff database.
TLS 1.3
Transport Layer Security version 1.3. Modern encryption-in-transit standard.

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